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1 lead tape
стрічка для упакування виводів (напр. резисторів)English-Ukrainian dictionary of microelectronics > lead tape
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2 tape
1) стрічковий носій (вивідних рамок) 2) стрічка - beam tape
- blister tape
- bumped tape
- carrier tape
- checkout tape
- compliant bonding tape
- interconnect tape
- lead tape
- masking tape
- test tape
- transport tape -
3 lead
1. ім. (гнучкий) вивід (корпуса), електродний вивід; провідник 2. дієсл. проводити; виводити - axial lead
- base lead
- beam lead
- bonding lead
- bond lead
- bottom-brazed lead
- buried lead
- butt lead
- cantilevered lead
- collector lead
- compliant lead
- electroformed lead
- gold-plated lead
- guide lead
- gull wing lead
- j- lead
- open j- lead
- overhanging lead
- radial lead
- resilient lead
- ribbon lead
- side-brazed lead
- spider lead
- support lead
- tape-automated-bonded leads -
4 bonding
термокомпресійне зварювання; термокомпресія; зварювання; з’єднання, прикріплення (див. т-ж bond, weld, welding) - aluminum bonding
- anodic bonding
- automated tape-carrier bonding
- back bonding
- ball bonding
- batch bonding
- beam-lead bonding
- beam tape-automated bonding
- bird’s-beak bonding
- blind bonding
- bumped tape-automated bonding
- cement bonding
- chip bonding
- chisel bonding
- compliant bonding
- diffused bonding
- diffusion bonding
- electron-beam bonding
- energy-pulse bonding
- eutetic bonding
- face -down bonding
- face bonding
- field-assisted bonding
- flip-chip bonding
- flux-free bonding
- fluxless bonding
- fusion bonding
- gang -lead bonding
- gang bonding
- gold ball bonding
- inboard bonding
- interconnection bonding
- laser bonding
- lead bonding
- nail-head bonding
- silicon fusion bonding
- spider bonding
- stitch bonding
- tape automated bonding (TAB)
- TC bonding
- thermal-pulse bonding
- thermocompression bonding
- thermosonic bonding
- wedge bonding
- wire bonding
- wobble bonding -
5 bonder
1) устаткування для термокомпресійного зварювання 2) устаткування для монтажу (напр. кристалів на кристалоносії) - beam tape-automated bonding bonder
- beam tape-automated bonder
- BTAB bonder
- bonder die bonder
- flip-chip aligner bonder
- hot gas bonder
- hot-tip bonder
- hybrid die bonder
- hybrid bonder
- inner-lead bonder
- microprocessor-controlled bonder
- nonflame spot bonder
- outer-lead bonder
- pulsed-heat bonder
- spot bonder
- TAB bonder
- tape-automated bonding bonder
- tape-automated bonder
- thermocompression bonder
- thermosonic bonder
- ultrasonic bonder
- wedge bonder
- wire bonder -
6 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
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7 component
компонент; елемент (див. т-ж element) - added [add-on] component
- axial-lead component
- bubble component
- bumped component
- chip component
- conventional component
- dedicated component
- diffused component
- discrete component
- electrooptical component
- encapsulated component
- external component
- functional component
- hybrid component
- integrated -circuit component
- integrated component
- known-good component
- large-scale integration component
- lateral etch component
- molded component
- monolithic component
- naked component
- off-the-shelf component
- out-of-tolerance component
- packaged component
- passive component
- potted component
- printed component
- programmable system component
- reeled components
- screened component
- single component
- solid-state component
- system component
- tape -mounted components
- tape components
- uncased component
- uncommitted componentEnglish-Ukrainian dictionary of microelectronics > component
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8 packaging
1) монтаж в корпусі, корпусування 2) збірка (і герметизація). Процес монтажу компонентів в контейнер, який має зовнішні межі для захисту компонентів - beamless tape packaging
- beam tape packaging
- bulk packaging
- chip packaging
- fluidized-bed packaging
- high-density packaging
- hybrid packaging
- integrated-circuit packaging
- plastic packaging
- static protective packaging
- wafer level packaging WLP
- wafer level packagingEnglish-Ukrainian dictionary of microelectronics > packaging
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9 assembly
1) збірка; монтаж 2) збірка; вузол - beam tape-automated assembly
- charge-shift assembly
- chip assembly
- chip-and-substrate assembly
- chip-carrier assembly
- chip-on-board assembly
- “cut and paste” assembly
- flip-chip assembly
- header assembly
- hybrid assembly
- microelectronic modular assembly
- molded assembly
- multichip assembly
- operating assembly
- semiconductor assembly
- step-by-step assembly
- surface-mounted assembly -
10 tester
1) випробувальне устаткування, устаткування для випробування, тестер 2) вимірювальний прилад, вимірювач - bench-top tester
- bubble tester
- die shear tester
- flatness tester
- high-speed tester
- laser-based tester
- lead pull tester
- logic tester
- LSI board tester
- moisture tester
- stick-to-stick bubble tester
- tape рееl tester
- thickness tester
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